Courses

Course Overview

This training program is designed to provide participants with a comprehensive understanding of thermal management in electronic systems. The course covers the fundamental principles of heat transfer—conduction, convection, and radiation—and explores how these principles apply to real-world electronics cooling challenges. Participants will delve into various cooling techniques, including heat sinks, thermal interface materials (TIM), fans, Peltier (thermoelectric) cooling (TEC), heat pipes, and refrigeration. The course balances theory with practical applications, giving attendees the skills to effectively design and optimize cooling solutions for electronic devices.

Target Audience

• Electronic Design Engineers, Mechanical Engineers, Thermal Engineers, and Test and Validation Engineers
• Manufacturing Engineers and Quality Control Personnel
• Assembly personnel
• Research and Development Teams and Product Managers
• Project Managers, Technical Leads, and Corporate Executives

Learning Outcomes

By the end of the course, participants will be able to:

• Understand heat transfer modes and their relevance in electronics
• Design and evaluate cooling strategies using heat sinks, fans, and TIM
• Apply advanced cooling technologies like TEC, heat pipes, and refrigeration
• Optimize electronics for improved thermal performance and reliability
• Diagnose and troubleshoot thermal issues in electronic systems
• Balance cost and efficiency in designing thermal management solutions